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Ultrasonic microscope Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

Ultrasonic microscope Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. アイテス Shiga//Electronic Components and Semiconductors
  2. null/null
  3. 一般財団法人材料科学技術振興財団　MST Tokyo//Testing, Analysis and Measurement
  4. 日本バーンズ 東京本社 Tokyo//Trading company/Wholesale
  5. 明治電機工業 Aichi//Trading company/Wholesale
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Ultrasonic microscope Product ranking

Last Updated： Aggregation Period:Feb 04, 2026～Mar 03, 2026
This ranking is based on the number of page views on our site.

  1. [C-SAM] Ultrasonic Microscopy Method 一般財団法人材料科学技術振興財団　MST
  2. High-precision ultrasonic microscope 'D9600 C-SAM' 日本バーンズ 東京本社
  3. Ultrasonic Microscope 'SAM' アイテス
  4. Ultrasonic Microscope 'Gen6'
  5. 4 Introduction to Ultrasonic Microscopy (Principle and Features)

Ultrasonic microscope Product List

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Ultrasonic Microscope 'SAM'

Ultrasonic Microscope 'SAM'

Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!

We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.

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Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.

We would like to introduce our ultrasonic microscope observation of semiconductor packages. Due to storage conditions and mounting conditions, delamination can occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be confirmed visually from the outside. By using an ultrasonic microscope, we can clearly capture the internal structure of the package and contribute to reliability evaluation. 【Features】 ■ Ultrasonic microscope observation from the chip side - By changing the focal position, previously unseen areas of the same sample become visible. ■ Ultrasonic microscope observation from the die pad side - Delamination conditions can be confirmed at various locations even with the same focus. *For more details, please download the PDF or feel free to contact us.

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  • Ultrasonic microscope

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[C-SAM] Ultrasonic Microscopy Method

[C-SAM] Ultrasonic Microscopy Method

C-SAM is a non-destructive method for observing defects such as delamination within a sample.

C-SAM is also known as SAT: Scanning Acoustic Tomography. - It is effective for confirming the "bonding state of electrodes" and "adhesion of bonded wafers," which are difficult to verify with X-ray CT observations. - In addition to reflected waves, transmission waves can also be acquired.

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  • Circuit board design and manufacturing
  • Ultrasonic microscope

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High-precision ultrasonic microscope 'D9600 C-SAM'

High-precision ultrasonic microscope 'D9600 C-SAM'

A high-precision ultrasonic microscope that conducts inspection and analysis tasks quickly and accurately! It allows for non-destructive observation of the internal conditions of samples!

The "D9600 C-SAM" is a standard model product from Sonoscan, a company that boasts a world-leading share in ultrasonic microscopy. It captures and images the reflected ultrasonic waves emitted by a transducer at a constant depth (focus) within the sample, allowing for non-destructive observation of the internal conditions of the sample. Different bonding surfaces of materials and areas with air layers exhibit unique reflections, enabling the detection of subtle differences compared to normal areas through accurate measurement and analysis. 【Features】 ■ Equipped with a linear motor scanner ■ Standard scan reference included ■ Capable of detecting and imaging even weak signal waveform changes within the gate with higher sensitivity ■ Supports multilingual display including Japanese, English, and Chinese ■ Can simultaneously scan multiple different depths ■ Capable of measuring up to 100 gates *For more details, please request documentation or view the PDF data available for download.

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[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!

Here is a case study of observing the adhesive state through a metal plate using an ultrasonic microscope. The ultrasonic microscope can confirm internal information that cannot be seen from the exterior, as long as the ultrasonic waves can penetrate. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion state between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.

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High-precision ultrasonic microscope "Gen6"

High-precision ultrasonic microscope "Gen6"

Supports analysis that makes it difficult to separate interface waveforms of each layer! Also compatible with multilingual display.

The "Gen6" is a high-precision ultrasonic microscope that can detect even weak signal waveform changes within the gate with higher sensitivity and is capable of imaging. It can simultaneously scan multiple depths and can measure up to 100 gates. Furthermore, with the inclusion of the "SonoSimulator," it supports the analysis of stack dies and thin-film multilayer samples, where it is difficult to separate the interface waveforms of each layer. 【Features】 ■ High-speed sampling rate ■ Water recirculation system ■ Equipped with PolyGate function ■ Standard scan and reference included ■ Compatible with Windows 7 (64bit) Company Name: Japan Burns Co., Ltd. *For more details, please refer to the PDF document or feel free to contact us.

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